APPARATUS AND METHOD FOR ABRADING SEMICONDUCTOR WAFER

Details for Australian Patent Application No. 2001272782 (hide)

Owner KABUSHIKI KAISHA ISHIIHYOKI

Inventors NAKANO, Teruyuki; KOZAWA, Yasuhiro; TAMBO, Hitoshi; NAKAHASHI, Manabu

Pub. Number AU-A-2001272782

PCT Pub. Number WO2002/054471

Priority 2000-397782 27.12.00 JP

Filing date 23 July 2001

Wipo publication date 16 July 2002

International Classifications

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

23 January 2003 Application Open to Public Inspection

  Published as AU-A-2001272782

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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