Die Attach Composition For Silicon Chip Placement On A Flat Substrate Having Improved Thixotropic Properties

Details for Australian Patent Application No. 2012200208 (hide)

Owner Lexmark International, Inc

Inventors Graham, David; Provence, Joel; Singh, Jeanne Marie Saldanha; Wells, Richard D.

Agent Wrays

Pub. Number AU-A-2012200208

Priority 13/008,428 18.01.11 US

Filing date 13 January 2012

Wipo publication date 2 August 2012

International Classifications

C09J 163/02 Adhesives based on epoxy resins - Polyglycidyl ethers of bis-phenols

B41J 2/05 Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed - produced by the application of heat

C01F 7/02 Compounds of aluminium

C09J 163/00 Adhesives based on epoxy resins

H01L 23/34 Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

Event Publications

2 February 2012 Complete Application Filed

  Priority application(s): 13/008,428 18.01.11 US

2 August 2012 Application Open to Public Inspection

  Published as AU-A-2012200208

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