Printed wiring board, method of soldering quad flat package IC, and air conditioner
Details for Australian Patent Application No. 2011244908 (hide)
International Classifications
Event Publications
17 November 2011 Complete Application Filed
Priority application(s): 2011-006339 14.01.11 JP
2 August 2012 Application Open to Public Inspection
Published as AU-A-2011244908
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