Thermal interface material for reducing thermal resistance and method of making the same

Details for Australian Patent Application No. 2011221431 (hide)

Owner GE Intelligent Platforms, Inc.

Inventors Kirk, Graham Charles

Agent Phillips Ormonde Fitzpatrick

Pub. Number AU-A-2011221431

Priority 12/879,766 10.09.10 US

Filing date 9 September 2011

Wipo publication date 29 March 2012

International Classifications

H01L 23/373 (2006.01) Details of semiconductor or other solid state devices

H01L 21/48 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

22 September 2011 Complete Application Filed

  Priority application(s): 12/879,766 10.09.10 US

29 March 2012 Application Open to Public Inspection

  Published as AU-A-2011221431

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