A method of inhibiting formation of deposits in a manufacturing system

Details for Australian Patent Application No. 2010273462 (hide)

Owner Hemlock Semiconductor Corporation

Inventors Dehtiar, Max; Giardina, Jason; Vanderhovel, Jaime; Hofmeister, Michael; Molnar, Michael John; Stratton, Robert E.; Pawelkowski, Stephen

Agent Wrays

Pub. Number AU-A-2010273462

PCT Pub. Number WO2011/008849

Priority 61/225,347 14.07.09 US

Filing date 14 July 2010

Wipo publication date 20 January 2011

International Classifications

C23C 16/44 (2006.01) Chemical deposition or plating by decomposition - characterised by the method of coating

C23C 16/24 (2006.01) Chemical deposition or plating by decomposition

C23C 16/458 (2006.01) Chemical deposition or plating by decomposition - characterised by the method used for supporting substrates in the reaction chamber

C23C 16/52 (2006.01) Chemical deposition or plating by decomposition - Controlling or regulating the coating process

F25B 43/00 (2006.01) Arrangements for separating or purifying gases or liquids

F25B 47/00 (2006.01) Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass

Event Publications

2 February 2012 PCT application entered the National Phase

  PCT publication WO2011/008849 Priority application(s): WO2011/008849

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