Method for manufacturing composite substrate on which wide bandgap semiconductor is laminated

Details for Australian Patent Application No. 2009325425 (hide)

Owner Shin-Etsu Chemical Co., Ltd.

Inventors Akiyama, Shoji

Agent Wrays

Pub. Number AU-A-2009325425

PCT Pub. Number WO2010/067835

Priority 2008-315566 11.12.08 JP; 2009-278561 08.12.09 JP

Filing date 10 December 2009

Wipo publication date 17 June 2010

International Classifications

H01L 21/02 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof -

H01L 21/265 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

16 June 2011 PCT application entered the National Phase

  PCT publication WO2010/067835 Priority application(s): WO2010/067835

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