Integrated sensor including sensing and processing die mounted on opposite sides of package substrate

Details for Australian Patent Application No. 2009307832 (hide)

Owner Honeywell International Inc.

Inventors Zhang, Wenwei; Muslek, Len; Boyd, Jamie; Nesbitt, Mark; Dalziel, Martyn

Agent Davies Collison Cave

Pub. Number AU-A-2009307832

PCT Pub. Number WO2010/048102

Priority 12/580,968 16.10.09 US; 61/107,631 22.10.08 US

Filing date 20 October 2009

Wipo publication date 29 April 2010

International Classifications

H01L 23/48 (2006.01) Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 23/495 (2006.01) Details of semiconductor or other solid state devices

Event Publications

12 May 2011 PCT application entered the National Phase

  PCT publication WO2010/048102 Priority application(s): WO2010/048102

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