Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die

Details for Australian Patent Application No. 2009217526 (hide)

Owner Honeywell International Inc.

Inventors Bentley, Ian; Bradley, Alistair D.

Agent Davies Collison Cave

Pub. Number AU-A-2009217526

PCT Pub. Number WO2009/108482

Priority 12/038,156 27.02.08 US

Filing date 10 February 2009

Wipo publication date 3 September 2009

International Classifications

H01L 23/50 (2006.01) Details of semiconductor or other solid state devices

Event Publications

2 September 2010 PCT application entered the National Phase

  PCT publication WO2009/108482 Priority application(s): WO2009/108482

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