Process for copper electrodeposition in the microelectronics industry for submicro features, electrowinning and electrorefining

Details for Australian Patent Application No. 2006900881 (hide)

Event Publications

9 March 2006 Provisional Application Filed

30 March 2006 Amendment Made

The nature of the amendment is: Amend the invention title to read Process for copper electrodeposition in the microelectronics industry for submicron features, electrowinning and electrorefining

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