WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH A REVERSIBLE WEDGE BONDING TOOL

Details for Australian Patent Application No. 2003255904 (hide)

Owner KONINKLIJKE PHILIPS ELECTRONICS N.V.

Inventors VASQUEZ, Ramil, N.; ABADILLA, Esteban, L.; ROGADO, Alexander, M.; LICTAO, Crispulo, Jr.

Pub. Number AU-A-2003255904

PCT Number PCT/IB03/03580

PCT Pub. Number WO2004/020137

Priority 0219910.7 28.08.02 GB; 0225811.9 06.11.02 GB

Filing date 7 August 2003

Wipo publication date 19 March 2004

International Classifications

B23K 020/00 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating

B23K 020/10 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating - making use of vibrations, e.g. ultrasonic welding

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/607 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B29C 065/08 Joining of preformed parts - using ultrasonic vibrations

Event Publications

6 November 2003 Complete Application Filed

  Priority application(s): 0219910.7 28.08.02 GB; 0225811.9 06.11.02 GB

6 May 2004 Application Open to Public Inspection

  Published as AU-A-2003255904

12 May 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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