LEADLESS SEMICONDUCTOR PACKAGING STRUCTURE WITH INVERTED FLIP CHIP AND METHODS OF MANUFACTURE

Details for Australian Patent Application No. 2003253569 (hide)

International Classifications

Event Publications

30 October 2003 Complete Application Filed

Priority application(s): 10/314,716 09.12.02 US

5 August 2004 Application Open to Public Inspection

Published as AU-A-2003253569

25 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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