CIRCUIT SUBSTRATE, MULTI-LAYER WIRING PLATE, CIRCUIT SUBSTRATE MANUFACTURING METHOD, AND MULTI-LAYER WIRING PLATE MANUFACTURING METHOD

Details for Australian Patent Application No. 2003252302 (hide)

International Classifications

Event Publications

16 October 2003 Complete Application Filed

Priority application(s): 2003-42238 20.02.03 JP; 2003-131093 09.05.03 JP; 2002-222101 30.07.02 JP

25 March 2004 Application Open to Public Inspection

Published as AU-A-2003252302

28 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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