METHOD FOR FABRICATING SEMICONDUCTOR WAFER

Details for Australian Patent Application No. 2003252248 (hide)

Owner DISCO CORPORATION

Inventors ARAI, Kazuhisa

Pub. Number AU-A-2003252248

PCT Number PCT/JP03/09338

PCT Pub. Number WO2004/019388

Priority 2002-240578 21.08.02 JP

Filing date 23 July 2003

Wipo publication date 11 March 2004

International Classifications

H01L 021/02 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof -

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/306 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

16 October 2003 Complete Application Filed

  Priority application(s): 2002-240578 21.08.02 JP

22 April 2004 Application Open to Public Inspection

  Published as AU-A-2003252248

5 May 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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