METHOD OF ATTACHING CIRCUITRY TO A MODULAR JACK CONNECTOR USING ELECTRICALLY CONDUCTIVE PASTE

Details for Australian Patent Application No. 2003247369 (hide)

Owner ORMET CIRCUITS, INC.

Inventors GANDHI, Pradeep

Pub. Number AU-A-2003247369

PCT Number PCT/US03/15352

PCT Pub. Number WO2003/098745

Priority 10/147,371 15.05.02 US

Filing date 13 May 2003

Wipo publication date 2 December 2003

International Classifications

H01R 012/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks

H05K 001/00 Printed circuits

Event Publications

2 October 2003 Complete Application Filed

  Priority application(s): 10/147,371 15.05.02 US

29 January 2004 Application Open to Public Inspection

  Published as AU-A-2003247369

7 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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