RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, AND LAMINATE OBTAINED WITH THE SAME

Details for Australian Patent Application No. 2003242007 (hide)

Owner MATSUSHITA ELECTRIC WORKS, LTD.

Inventors MOTOBE, Hidetsugu; HIBINO, Akinori; ITO, Katsuhiko

Pub. Number AU-A-2003242007

PCT Number PCT/JP03/07052

PCT Pub. Number WO2004/108791

Filing date 3 June 2003

Wipo publication date 4 January 2005

International Classifications

C08G 059/22 Polycondensates containing more than one epoxy group per molecule

H05K 001/03 Printed circuits - Use of materials for the substrate

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

C08G 059/62 Polycondensates containing more than one epoxy group per molecule

C08J 005/24 Manufacture of articles or shaped materials containing macromolecular substances - Impregnating materials with prepolymers which can be polymerised , e.g. manufacture of prepregs

Event Publications

11 September 2003 Complete Application Filed

10 February 2005 Application Open to Public Inspection

  Published as AU-A-2003242007

23 February 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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