PACKAGE PART AND METHOD OF MANUFACTURING THE PART

Details for Australian Patent Application No. 2003207259 (hide)

Owner MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventors YOSHIKAWA, Yoshishige

Pub. Number AU-A-2003207259

PCT Number PCT/JP03/00515

PCT Pub. Number WO2003/063231

Priority 2002-13887 23.01.02 JP; 2002-13888 23.01.02 JP; 2002-13889 23.01.02 JP

Filing date 22 January 2003

Wipo publication date 2 September 2003

International Classifications

H01L 021/56 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/31 Details of semiconductor or other solid state devices

H03H 009/02 Networks comprising electromechanical or electro-acoustic elements - Details

H03H 003/00 Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators

H01L 023/29 Details of semiconductor or other solid state devices

Event Publications

17 July 2003 Complete Application Filed

  Priority application(s): 2002-13887 23.01.02 JP; 2002-13888 23.01.02 JP; 2002-13889 23.01.02 JP

18 September 2003 Application Open to Public Inspection

  Published as AU-A-2003207259

7 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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