APPARATUS FOR MOLDING A SEMICONDUCTOR WAFER AND PROCESS THEREFOR

Details for Australian Patent Application No. 2002366146 (hide)

Owner ADVANCED SYSTEMS AUTOMATION LTD

Inventors CHEW HWEE SENG, Jimmy; XIA, Dingwei

Pub. Number AU-A-2002366146

PCT Number PCT/SG02/00229

PCT Pub. Number WO2003/044850

Priority 0106164-7 05.10.01 SG

Filing date 4 October 2002

Wipo publication date 10 June 2003

International Classifications

H01L 021/56 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B29C 045/26 Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould - Moulds

B29C 045/40 Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould - Removing or ejecting moulded articles

B29C 045/73 Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould - of the mould

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

Event Publications

14 August 2003 Complete Application Filed

  Priority application(s): 0106164-7 05.10.01 SG

21 August 2003 Application Open to Public Inspection

  Published as AU-A-2002366146

24 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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