ACTIVE WAFER COOLING DURING DAMAGE ENGINEERING IMPLANT TO ENHANCE BURIED OXIDE FORMATION IN SIMOX WAFERS

Details for Australian Patent Application No. 2002356902 (hide)

Owner IBIS TECHNOLOGY CORPORATION

Inventors EROKHIN, Yuri; BLAKE, Julian, G.

Pub. Number AU-A-2002356902

PCT Number PCT/US02/35382

PCT Pub. Number WO2003/041160

Priority 10/011,518 05.11.01 US

Filing date 4 November 2002

Wipo publication date 19 May 2003

International Classifications

H01L 021/76 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/265 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01J 037/317 Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof - for changing properties of the objects or for applying thin layers thereon, e.g. ion implantation

Event Publications

27 March 2003 Complete Application Filed

  Priority application(s): 10/011,518 05.11.01 US

24 July 2003 Application Open to Public Inspection

  Published as AU-A-2002356902

22 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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