METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMANCE OF SEMICONDUCTOR DEVICES BY SURFACE MODIFICATION

Details for Australian Patent Application No. 2002356887 (hide)

Owner INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventors LANE, Michael, W.; LINIGER, Eric, G.; FITZSIMMONS, John, A.; GATES, Stephen, M.

Pub. Number AU-A-2002356887

PCT Number PCT/US02/35116

PCT Pub. Number WO2004/042817

Filing date 31 October 2002

Wipo publication date 7 June 2004

International Classifications

H01L 023/12 Details of semiconductor or other solid state devices - Mountings, e.g. non-detachable insulating substrates

H01L 023/053 Details of semiconductor or other solid state devices

H01L 021/44 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/48 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/50 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

27 March 2003 Complete Application Filed

1 July 2004 Application Open to Public Inspection

  Published as AU-A-2002356887

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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