CERIUM-BASED POLISH AND CERIUM-BASED POLISH SLURRY

Details for Australian Patent Application No. 2002349782 (hide)

Owner SHOWA DENKO K.K.

Inventors BESSHO, Naoki

Pub. Number AU-A-2002349782

PCT Number PCT/JP02/11925

PCT Pub. Number WO2003/042321

Priority 2001-350968 16.11.01 JP; 60/331,614 20.11.01 US

Filing date 15 November 2002

Wipo publication date 26 May 2003

International Classifications

C09K 003/14 Materials not provided for elsewhere - Anti-slip materials

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C01F 017/00 Compounds of the rare-earth metals, i.e. scandium, yttrium, lanthanum, or the group of the lanthanides

B24B 037/00 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped

Event Publications

20 March 2003 Complete Application Filed

  Priority application(s): 2001-350968 16.11.01 JP; 60/331,614 20.11.01 US

24 July 2003 Application Open to Public Inspection

  Published as AU-A-2002349782

5 August 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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