METHOD AND APPARATUS FOR UNDERFILLING ELECTRONIC COMPONENTS USING VACUUM ASSIST

Details for Australian Patent Application No. 2002346082 (hide)

Owner NORDSON CORPORATION

Inventors HUEY, Brett; PADGETT, David, N.; QUINONES, Horatio

Pub. Number AU-A-2002346082

PCT Number PCT/US02/21458

PCT Pub. Number WO2003/006230

Priority 60/334,682 31.10.01 US; 29/162,409 14.06.02 US; 29/162,410 14.06.02 US; 60/303,855 09.07.01 US; 60/303,990 09.07.01 US; 60/341,010 30.10.01 US; 60/341,011 30.10.01 US; 29/151,038 31.10.01 US; 60/335,090 31.10.01 US

Filing date 8 July 2002

Wipo publication date 29 January 2003

International Classifications

B29C 070/72 Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts

H01L 021/44 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

6 March 2003 Complete Application Filed

  Priority application(s): 60/334,682 31.10.01 US; 29/162,409 14.06.02 US; 29/162,410 14.06.02 US; 60/303,855 09.07.01 US; 60/303,990 09.07.01 US; 60/341,010 30.10.01 US; 60/341,011 30.10.01 US; 29/151,038 31.10.01 US; 60/335,090 31.10.01 US

22 May 2003 Application Open to Public Inspection

  Published as AU-A-2002346082

8 April 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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