A METHOD FOR BONDING A PAIR OF SILICON WAFERS TOGETHER AND A SEMICONDUCTOR WAFER

Details for Australian Patent Application No. 2002339592 (hide)

Owner ANALOG DEVICES INC.

Inventors NEVIN, William, Andrew; McCANN, Paul, Damien; O'NELL, Garry, Patrick

Pub. Number AU-A-2002339592

PCT Number PCT/IB02/04439

PCT Pub. Number WO2003/038884

Priority 60/350,976 29.10.01 US

Filing date 25 October 2002

Wipo publication date 12 May 2003

International Classifications

H01L 021/306 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/20 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

27 February 2003 Complete Application Filed

  Priority application(s): 60/350,976 29.10.01 US

10 July 2003 Application Open to Public Inspection

  Published as AU-A-2002339592

15 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002339593-MAGNETIC RESONANCE METHOD FOR FORMING A FAST DYNAMIC IMAGE

2002339591-PARTIALLY FILLING BLOCK INTERLEAVER FOR A COMMUNICATION SYSTEM