FLUX COMPOSITION FOR SOLDER, SOLDER PASTE, AND METHOD OF SOLDERING

Details for Australian Patent Application No. 2002338041 (hide)

Owner NOF CORPORATION

Inventors NAKATA, Isao; SAITO, Shun; NAKASATO, Katsumi; KATO, Yukihiro

Pub. Number AU-A-2002338041

PCT Number PCT/JP02/09946

PCT Pub. Number WO2003/026835

Priority 2002/16302 25.01.02 JP; 2002/93702 29.03.02 JP; 2002/97483 29.03.02 JP; 2001/295165 26.09.01 JP; 2002/16301 25.01.02 JP

Filing date 26 September 2002

Wipo publication date 7 April 2003

International Classifications

B23K 035/363 Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

Event Publications

20 February 2003 Complete Application Filed

  Priority application(s): 2002/16302 25.01.02 JP; 2002/93702 29.03.02 JP; 2002/97483 29.03.02 JP; 2001/295165 26.09.01 JP; 2002/16301 25.01.02 JP

26 June 2003 Application Open to Public Inspection

  Published as AU-A-2002338041

17 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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