SEMICONDUCTOR STRUCTURES AND DEVICES HAVING AN INTERMETALLIC LAYER

Details for Australian Patent Application No. 2002303463 (hide)

Owner MOTOROLA, INC.

Inventors TALIN, Albert, A.; HILT, Lyndee, L.; DEMKOV, Alexander, A.

Pub. Number AU-A-2002303463

PCT Number PCT/US02/12971

PCT Pub. Number WO2003/009376

Priority 09/908,892 20.07.01 US

Filing date 23 April 2002

Wipo publication date 3 March 2003

International Classifications

H01L 021/8258 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 027/06 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - including a plurality of individual components in a non-repetitive configuration

Event Publications

12 December 2002 Complete Application Filed

  Priority application(s): 09/908,892 20.07.01 US

22 May 2003 Application Open to Public Inspection

  Published as AU-A-2002303463

8 April 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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