PHOTOSENSITIVE FILM FOR CIRCUIT FORMATION AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

Details for Australian Patent Application No. 2002243008 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors KUBOTA, Masao; OHASHI, Takeshi; ICHIKAWA, Tatsuya

Pub. Number AU-A-2002243008

PCT Pub. Number WO2002/079878

Priority 2001-096138 29.03.01 JP

Filing date 29 March 2002

Wipo publication date 15 October 2002

International Classifications

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

G03F 007/033 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

G03F 007/004 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Photosensitive materials

H05K 003/06 Apparatus or processes for manufacturing printed circuits - the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

H05K 003/18 Apparatus or processes for manufacturing printed circuits - using precipitation techniques to apply the conductive material

Event Publications

3 April 2003 Application Open to Public Inspection

  Published as AU-A-2002243008

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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