METHOD AND APPARATUS FOR MEASURING EFFECTS OF PACKAGING STRESSES OF COMMON IC ELECTRICAL PERFORMANCE PARAMETERS AT WAFER SORT

Details for Australian Patent Application No. 2002219837 (hide)

Owner ADVANCED MICRO DEVICES, INC.

Inventors SIDHARTH; BLISH, Richard, C., II

Pub. Number AU-A-2002219837

PCT Pub. Number WO2002/056347

Priority 09/757,118 09.01.01 US

Filing date 13 November 2001

Wipo publication date 24 July 2002

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

6 February 2003 Application Open to Public Inspection

  Published as AU-A-2002219837

5 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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