PHOTOSENSITIVE RESIN COMPOSITION AND PRINTED WIRING BOARDS

Details for Australian Patent Application No. 2002217554 (hide)

Owner TAIYO INK MFG. CO., LTD.

Inventors LIN, Yuan Chien; NISHIO, Kazunori; NAKADA, Toru

Pub. Number AU-A-2002217554

PCT Pub. Number WO2003/059975

Filing date 28 December 2001

Wipo publication date 30 July 2003

International Classifications

C08F 299/02 Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers

C09D 011/00 Inks

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

C08G 059/14 Polycondensates containing more than one epoxy group per molecule

H05K 003/28 Apparatus or processes for manufacturing printed circuits - Applying non-metallic protective coatings

Event Publications

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2002217554

16 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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